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| IR2E51Y IR2E51Y Auto-Brightness Control LED Driver Description IR2E51Y incorporates white LED driver with auto brightness control. This IC is equipped with charge pump DC/DC converter. Input voltage is boosted into CPO by a charge pump circuit. This IC maintains high efficiency since the charge pump circuit automatically selects 1x or 1.5x charge pump mode depending on input voltage and load. It contains 4 white LED drivers to drive the main-LCD backlight, 2 white LED drivers for sub-LCD backlight and RGB-LED drivers. All LED are connected in parallel. With peripheral ambient light sensor, this IC automatically adjusts white LED brightness to ambient brightness. This IC supports I2C-Bus interface. This product is optimum for use as the backlight white LED driver IC for cellular phone and PDA applications, etc. Agency approvals/Compliance 1. Compliant with RoHS directive(2002/95/EC) Applications 1.Back light and call alert display (White & RGB LED) Features 1. Supply Voltage Range: VIN=3.0V to 4.5V, VCC=2.3V to 3.2V 2. Supports I2C-Bus interface 3. SCL pin and SDA pin are installed with noise filters. 4. Sink-type variable constant current driver for LED (maximum current 27.4mA/ch) 5. Monitoring all LED pins (Response to VF variation of LED) 6.Auto brightness control circuit for main-LCD embedded. (16 steps and 128 gradation sequence) 7.PWM LED Brightness Control (0% to 100%) (RGB) (The PWM signal frequency of 2kHz to 5kHz is recommended.) 8.1x/1.5x Modes Charge Pump: Automatically Selected 9.Voltage reference embedded 10.Stand-by circuit embedded 11.Power-on-reset circuit embedded 12.Soft-Start Limits Inrush Current 13.Effective illuminance range (3lx to 55000lx) (GA1A1S201WP) Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: F1-A00101EN Date Dec.01.2006 (c)SHARP Corporation IR2E51Y Block diagram COUT CPO VIN CIN C1P C1 C1N C2P M1 M2 M3 M4 S1 S2 R G B EN_RGB I:0V-VDD PGND1 PGND2 VCC SW GND O:0V-VCC C2 C2N CGND *CHARGE PUMP *TYP 660kHz PD IREF_PD SENSOR RIREF_PD VDD I:0V-VDD 1.8V CVDD *Control driver current *Control auto brightness control I2C-BUS KEY GND O:0V-VCC CVCC 2.3V~3.2V KEY PAD Sheet No.: F1-A00101EN IR2E51Y Outline Dimensions (Unit : mm) (Note)It is those with an underline printing in a date code because of a LEAD FREE type. A B INDEX(laser marking) TOP VIEW S 0.1 0.820.08 SIDE VIEW S 0.28(TYP.) 0.170.03 S 0.08 D 3.570.05 P-0.5(TYP.) C ABCDE D F BOTTOM VIEW 1 2 3 4 5 6 P-0.5(TYP.) 0.290.05 3.570.05 0.20 M S AB 0.10 M S CD Package name : WLP035-X-3636 Lead finish or Ball type : LEAD FREE TYPE(Sn-3Ag-0.5Cu) *Use of an "Under-fill" Package weight. : 0.03g/pcs. About. (Note) Body dimensions do not include burr of resin. *Use of an "Under-fill": Since the external terminals are arranged at intervals of 0.5mm, SHARP recommends use of appropriate "Under fill" to this product for high reliability. Markings. 1 2 3 Product name IR2E51 Company name SHARP Date code ExampleYYWW XXXX YY Denotes the production year. (Last two digits of the year.) WW Denotes the production week.01025253 XXXX Denotes the production ref. code. "JAPAN" indicates the country of origin. 4 Sheet No.: F1-A00101EN IR2E51Y Terminal Name Pin No A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C4 C5 C6 D1 D2 D3 D4 D5 D6 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 Pin name U1A SW PD VDD SCL U2A EN_RGB IREF_PD VCC SDA KEY M2 G IREF XRESET M1 PGND1 PGND2 B GND2 GND1 M3 M4 VIN R C1N S1 S2 CGND U1F C1P CPO C2P C2N U2F Description Non-connect. This terminal is connected pin No. F1 (U1F). Terminal of VCC output switch circuit for peripheral ambient light sensor. Ambient light sensor terminal for auto brightness control (logarithmic output current type). Supply voltage for I2C. I2C clock input. Non-connect. This terminal is connected pin No. F6 (U2F). Enable for RGB LED. Resistor connection terminal for reference current setting of auto brightness control. Power supply terminal. I2C data Input/Output terminal. Control signal output terminal which disables key pad LED. Constant current output terminal for main LED2. Constant current output terminal for green LED. Resistor connection terminal for reference current setting of LED drivers. Hard reset terminal. Constant current output terminal for main LED1. Main and sub LED driver ground. RGB-LED driver ground. Constant current output terminal for blue LED. Ground terminal for control. Ground terminal for control. Constant current output terminal for main LED3. Constant current output terminal for main LED4. Power supply terminal for charge pump. Constant current output terminal for red LED. Flying capacitor 1 negative connection. Constant current output terminal for sub LED1 (It can be used as main LED5). Constant current output terminal for sub LED2 (It can be used as main LED6). Ground terminal for charge pump. Non-connect. This terminal is connected pin No. A1 (U1A). Flying capacitor 1 positive connection. Output voltage terminal of charge pump. Flying capacitor 2 positive connection. Flying capacitor 2 negative connection. Non-connect. This terminal is connected pin No. A6 (U2A). Sheet No.: F1-A00101EN IR2E51Y Pin Assignment 1 2 3 4 5 6 A U1A SW PD VDD SCL U2A B EN_RGB IREF_PD VCC SDA KEY M2 C G IREF XRESET M1 PGND1 D PGND2 B GND2 GND1 M3 M4 E VIN R C1N S1 S2 CGND F U1F C1P CPO C2P C2N U2F Note: Pins are located on the underside. Sheet No.: F1-A00101EN IR2E51Y Absolute Maximum Ratings Parameter Power supply Power supply Terminal voltage Terminal voltage1 Terminal voltage2 CPO output current Output current Power dissipation Derating ratio Operating temperature range Storage temperature range Symbol Rating Unit Conditions 5.5 VIN V 5.5 VCC VCCVIN V VDD -0.3V ~ VCC+0.3 V Vin1 -0.3V ~ VDD+0.3 V Input pin: EN_RGB,XRESET Vin2 -0.3V ~ VDD+0.3 Input pin: SCL,SDA V ICPO Total drive current mA 220 mA ILED Each drive pin current 35/ch Pd Ta25C Note1 1660 mW Pd Ta>25C Note1 16.6 mW/C Topr -20 ~ 85 C Tstg -55 ~ 125 C Note1: Free convection,on-board,compiled with SEMI42-996 Recommended Operating Condition Parameter Power supply Power supply Terminal voltage PD Pin input current LED Output current Oscillating frequency I2C communication frequency Symbol VIN VCC VDD IPD ILED fOSC fCLK Value 3.0 ~ 4.5 2.3 ~ 3.2 1.6 ~ VCC 5 ~ 50 3 ~ 55000 0.0 ~ 27.4 660 400 Unit V V V A lx mA kHz kHz Note:Correspond to logarithmic output current type ambient light sensor (Using sensor output:10*log(lx)[A]) RIREF_PD=15k RIREF=13k RIREF=13k Conditions Sheet No.: F1-A00101EN IR2E51Y Electric Characteristics See the Block Diagram unless otherwise specified. VIN=3.6V, VCC=2.5V, VDD=1.8V, Ta=25C, RIREF=13k, RIREF_PD=15k The current direction is regarded positive when entering the IC and negative when exiting. Current consumption Parameter Stand-by supply current VIN Supply current VCC Supply current VDD Supply current Voltage reference circuit Parameter IREF Pin voltage IREF_PD Pin voltage Symbol VREF VREF_PD Measurement condition RIREF=13k RIREF_PD=15k MIN. TYP. 480 480 MAX. Unit mV mV Symbol ISS1 IIN1 IIN2 ICC1 IVDD1 Measurement condition XSTB="0" VIN=4.2V,CPO output: 1x mode CPO output: No load current VIN=3V, CPO output: 1.5x mode CPO output: No load current MIN. - TYP. 0 0.17 3.0 0.7 0 MAX. 3 0.32 5.0 1.5 3 Unit A mA mA mA A VCC=2.5V(IPD no input current) VCC=1.8V Ambient light sensor interface circuit Symbol Dout_PD0 Illuminance output data (8bit) Dout_PD1 Dout_PD2 (Offset adjustment=00H) (Slope adjustment=00H) Dout_PD3 RIREF_PD=15k Dout_PD4 Dout_PD5 Illuminance offset D_OFSET0 adjustment sensitivity D_OFSET+1 (Offset adjustment D_OFSET+7 for sensor dispersion) D_OFSET-1 Slope adjustment=00H RIREF_PD=15k D_OFSET-8 Illuminance slope D_GAIN0 adjustment sensitivity D_GAIN+1 (Slope adjustment D_GAIN+7 for sensor dispersion) D_GAIN-1 Offset adjustment=00H RIREF_PD=15k D_GAIN-8 Parameter Measurement condition PD pin current=0A(open) PD pin current=10A PD pin current=20A PD pin current=30A PD pin current=40A PD pin current=50A Offset adjustment: 00H Offset adjustment:01H Offset adjustment:07H Offset adjustment:0FH Offset adjustment:08H Offset adjustment:00H Offset adjustment:01H Offset adjustment:07H Offset adjustment:0FH Offset adjustment:08H MIN. TYP. MAX. 00H 34H 64H 94H C8H F8H 0 +8 +56 -8 -64 0 +3.13 +21.90 -3.13 -25.04 Unit LSB LSB LSB LSB LSB % % % % % Sheet No.: F1-A00101EN IR2E51Y Constant current driver circuit Parameter Main output current (M1 pin, M2 pin, M3 pin, M4 pin) Symbol IM(7F) IM(63) IM(31) IM(00) IS(7F) IS(63) IS(31) IS(00) IR(7F) IR(63) IR(31) IR(00) IG(7F) IG(63) IG(31) IG(00) IB(7F) IB(63) IB(31) IB(00) LED1 LED2 IM IS IRGB Measurement condition Address 08H:7FH Address 08H:63H Address 08H:31H Address 08H:00H Address 09H:7FH Address 09H:63H Address 09H:31H Address 09H:00H Address 0AH:7FH Address 0AH:63H Address 0AH:31H Address 0AH:00H Address 0BH:7FH Address 0BH:63H Address 0BH:31H Address 0BH:00H Address 0CH:7FH Address 0CH:63H Address 0CH:31H Address 0CH:00H Voltage of current output pin: 0.35V1.3V Output current: 20mA Voltage of current output pin: 0.35V1.3V Output current4mA Voltage of current output pin: 0.8V Output current20mA Voltage of current output pin: 0.8V Output current20mA Voltage of current output pin: 0.8V Output current20mA MIN. 24.66 19.26 9.63 24.66 19.26 9.63 23.29 18.19 9.09 23.29 18.19 9.09 23.29 18.19 9.09 TYP. 27.40 21.40 10.70 0.00 27.40 21.40 10.70 0.00 27.40 21.40 10.70 0.00 27.40 21.40 10.70 0.00 27.40 21.40 10.70 0.00 1 1 1 1 1 MAX. 30.14 23.54 11.77 0.01 30.14 23.54 11.77 0.01 31.51 24.61 12.31 0.01 31.51 24.61 12.31 0.01 31.51 24.61 12.31 0.01 5 5 7.5 7.5 7.5 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA % % % % % Sub output current (S1 pin, S2 pin) R output current (R pin) G output current (G pin) B output current (B pin) LED drive pin Constant current1 LED drive pin Constant current2 Main output current relative margin Sub output current relative margin RGB output current relative margin Sheet No.: F1-A00101EN IR2E51Y Charge pump circuit Parameter CPO output inpedance1 CPO output inpedance2 Oscillating frequency0 Symbol ZCPO1 ZCPO2 fOSC0cp Measurement condition VIN=4V,CP at 1x mode ZCPO1=(VIN-VCPO)/Iout VIN=3V,CP 1.5x mode ZCPO2=(1.5xVIN-VCPO)/Iout Address:00H(Initial value 500 MIN. TYP. 1.2 2.8 660 820 MAX. Unit kHz SDA pin, SCL pin, EN_RGB pin, XRESET pin Parameter High level input voltage Low level input voltage High level input current Low level input current Hysteresis voltage SDA output pin voltage Reset pulse width Symbol VIH VIL IIH IIL Vhys VOL PWre Measurement condition MIN. TYP. MAX. Unit 0.7VDD VDD V 0 0.3VDD V -1 1 A -1 1 A 0.05VDD V 0.2VDD V 10 s IOL=3mA XRESET of the period of "L" KEY pin Parameter KEY output pin voltage KEY output pin voltage SW pin Parameter SW output pin voltage SW output pin voltage Symbol VOH VOL Measurement condition IOH=500A IOL=50A MAX. VCC-0.2 VCC-0.1 0.3 0.6 MIN. TYP. Unit V V Symbol VOH VOL Measurement condition IOH=100A IOL=100A MAX. VCC-0.6 VCC-0.3 0.3 0.6 MIN. TYP. Unit V V Sheet No.: F1-A00101EN IR2E51Y I2C-BUS Interface timing characteristics All specified output timings are based on 20% and 80% of VDD Fs-mode Parameter SCL clock frequency Hold time(repeated) START condition LOW period of the SCL clock HIGH period of the SCL clock Data set-up time Data hold time SCL and SDA rise time SCL and SDA fall time Capacitive load represented by each bus line Set-up time for STOP condition Tolerable spike width on bus Bus free time between START and STOP condition Noise margin at the LOW level for each connected device (including hysteresis) Noise margin at the HIGH level for each connected device (including hysteresis) Hs-mode Parameter SCLH clock frequency Set-up time(repeated) START condition Hold time(repeated) START condition LOW period of the SCLH clock HIGH period of the SCLH clock Data set-up time Data hold time Rise time of the SCLH signal Rise time of the SCLH signal after the acknowledge bit Fall time of the SCLH signal Rise time of the SDAH signal Fall time of the SCLH signal Set-up time for STOP condition Capacitive load for the SDAH and SCLH lines Capacitive load for the SDAH and SCLH lines Tolerable spike width on bus Noise margin at the LOW level for each connected device (including hysteresis) Noise margin at the HIGH level for each connected device (including hysteresis) Note 1: Cb=100pF total capacitance of one bus line. Symbol fSCLH tSU;STA tHD;STA tLOW tHIGH tSU;DAT tHD;DAT trCL trCL1 tfCL trDA tfCL1 tSU;STO Cb2 Cb tSP VnL VnH conditions MIN. 0 160 160 160 60 10 20 10 10 10 10 10 160 0.1xVDD 0.2xVDD Symbol fSCL tHD;STA tLOW tHIGH tSU;DAT tHD;DAT tr tf Cb tSU;STO tSP tBUF VnL VnH conditions MIN. 0 600 1300 600 100 0 20+0.1Cb 20+0.1Cb Note 1. Note 1. 600 1300 0.1xVDD 0.2xVDD TYP. - MAX. 400 400 50 - Unit kHz ns ns ns ns ns ns ns pF ns ns ns V V TYP. - MAX. 3.4 70 100 400 5 - Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns pF pF ns V V Sheet No.: F1-A00101EN IR2E51Y Fig.1 I2C-Bus timing diagram (Fs-mode) SDA tBUF tLOW tr tSU;DAT tf tHD;STA tSP tf tr SCL tSU;STO tHD;STA tHD;DAT tSU;STA tHIGH Fig.2 I2C-Bus timing diagram (Hs-mode) SDAH tSU;STA tHD;STA tHD;DAT tSU;DAT tHIGH trCL1 tSU;STO SCLH tfCL1 tLOW tfCL tHIGH tLOW tfCL Sheet No.: F1-A00101EN IR2E51Y Cautions Connect the ground pins (CGND, GND1, GND2, PGND1, PGND2) with the shortest distance and set pins same potential. It is recommended to install a capacitor between the power supply terminal and grounding terminal. Position a bypass capacitor between the power supply terminal and grounding pin close to the IC. Position a flying capacitor between the C1N-C1P pin and C2N-C2P pin close to the IC to reduce line resistance. To reduce the line resistance and ESR (serial resistance of flying capacitor) makes drop voltage small and conversion efficiency improvement when charge pump is boost-up. Position a smoothing capacitor between CPO and GND pin close to the IC to reduce line resistance. To reduce the line resistance and ESR (serial resistance of smoothing capacitor) makes drop voltage small and conversion efficiency improvement when charge pump is boost-up. Don't apply voltage CPO pin. Don't set input terminals (EN_RGB pin) floating. Supply input terminals (EN_RGB pin) with input voltage range specified electric characteristics. Use patterns as broad as and as short as possible for the power supply lines and grounding lines. In any case, use input voltage within the limits of maximum applied voltage. Position the IREF and IREF_PD pin close to the IC to circumvent the effect of noise. Connect driver terminal to ground when LED is unconnected. Other driver terminals should connect LED between CPO terminals. Don't put in strong light against IC when you use this IC. It is recommended that the output line of the ambient light sensor is inserted by ground line for protection from noises. It is recommended to insert a capacitor between the sensor's power supply terminal and sensor's ground terminal near the sensor. It is recommended to reset IC after setting VCC to "H". Sheet No.: F1-A00101EN IR2E51Y Important Notices * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: F1-A00101EN |
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